Wound Healing Activity of Consciousness Energy Healing Treatmenton HFF-1 Cells and DMEM Using Scratch Assay

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Investigative Dermatology and Venereology Research, 4(1), 50-54 (2018) .


Abstract

The wound healing activity using scratch assay is considered as a convenient in vitro tool for the assessment of wound healing. The present study deals with the optimization of Biofield Energy Treatment (Consciousness Energy Healing Treatment-The Trivedi Effect®) in the HFF-1 cell line (Human Foreskin Fibroblast) and DMEM (Dulbecco’s Modified Eagle Medium) using scratch assay against positive control, recombinant Human Epidermal Growth Factor (Hu EGF, 30 ng/mL). This method was used for the determination of cell proliferation and migration of fibroblast quantitatively in the scratched wounded area. The scratched area was monitored after 24 hours of wound closure in the Biofield Energy Treated HFF-1 cells and the Biofield Energy Treated DMEM groups, and the representative photomicrographs were taken in each wells using Wim Scratch Image analysis software. The results showed that the Biofield Energy Treated DMEM was significantly higher percentage of fibroblast migration i.e. 51.8%, while the migration was altered in the Biofield Energy Treated HFF-1 cell line compared to the baseline control group. In addition to, the percentage of scratch area was significantly decreased by 2.7% in the Biofield Energy Treated DMEM group, while it was increased by 12% in the Biofield Treated cells group compared to the baseline control group. Overall, the experimental results concluded that The Trivedi Effect® has the significant capacity and wide implications in wound healing activity via cell culture media, DMEM as compared with the HFF-1 cell line directly. Biofield Energy Healing would be a complementary and alternative medicine that can be used against burn injury cases, acute wound, skin regeneration, eczema, diaper rash, chickenpox, measles, warts, acne, hives, wrinkles, ringworm, Rosacea, psoriasis, seborrheic dermatitis, skin cancer, etc.



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